1 LED lamp package explanation Simply put, the LED package is the package of the LED (Light Emitting Diode) light-emitting chip. Compared with the integrated circuit package, there is a big difference, which is the process of packaging the LED packaging material into an LED lamp.

2 LED lamp packaging process Generally, LED packaging must go through the processes of crystal expansion-die bonding-wire bonding-glue filling-cutting feet-light and color separation;

3 led lamp packaging materials The main led packaging materials are: chips, gold wires, brackets, glue, etc.;

4 LED lamp packaging equipment. Die-expanding equipment, die bonding machine, wire bonding machine, glue dispenser, baking box, etc., are generally divided into two types of automatic packaging equipment and manual packaging equipment.

LED packaging methods mainly include the following methods:

1. Lead type (Lamp) LED package;

2. Surface mount (SMD) type (SMT-LED) package;

3. Chip-on-board (COB) LED packaging;

4. System packaged (SiP) LED package;

The packaging of the LED is not only required to protect the wick, but also to transmit light. Therefore, LED packaging has special requirements for packaging materials. LED packaging technology is mostly developed and evolved on the basis of discrete device packaging technology, but it has great particularity. Generally, the die of the discrete device is sealed in the package, and the function of the package is mainly to protect the die and complete electrical interconnection. The LED package is to complete the output of electrical signals, protect the normal operation of the die, and output: the function of visible light. It has both electrical parameters and optical parameter design and technical requirements. It is impossible to simply use discrete device packaging for LEDs.